Bergquist GapPad3500ULM柔軟有基材間隙填充導(dǎo)熱材料

材料生產(chǎn)商：美國貝格斯（BERGQUIST）公司研發(fā)產(chǎn)品

GapPad3500ULM GP3500ULM

GapPad350ULM可供規(guī)格：

厚度(Thickness)：0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm

片材(Sheet)：8”×16”（203×406 mm）

卷材(Roll)：無

導(dǎo)熱系數(shù)(Thermal Conductivity)：3.5W/m-k

基材(Reinfrcement Carrier)：玻璃纖維(或無玻璃纖維)

膠面(Glue)：雙面自帶粘性

顏色(Color)：灰黑色

包裝(Pack)：美國原裝進(jìn)口包裝

抗擊穿電壓(Dielectic Breakdown Voltage)（Vac）:＞5000

持續(xù)使用溫度（Continous Use Temp）：-60°~200°

GapPad350ULM應(yīng)用材料特性：

GapPad3500ULM在非常低的壓力下，低的S系列熱阻，高的貼服性，S系列軟度。針對低應(yīng)力應(yīng)用設(shè)計(jì)

玻纖增強(qiáng)，提高加工性能和搞斯裂性

Gap Pad® 3500ULM (ultra-low modulus) is an extremely soft gap filling material with a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to

a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress.

Gap Pad® 3500ULM maintains a conformable nature that allows for excellent interfacing and wet-out

characteristics, even to surfaces with high roughness and/or topography. Gap Pad® 3500ULM is offered with and without fiberglass and has higher natural inherent tack on one side of the material, eliminating the need for thermallyimpeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® 3500ULM is supplied with protective liners on both sides.

GapPad350ULM材料應(yīng)用：

處理器，服務(wù)器S-RAMS,大容量存儲驅(qū)動器，有線/無線通訊硬件，筆記本電腦，BGA封裝，功率轉(zhuǎn)換器

GapPad350ULM技術(shù)優(yōu)勢分析：

GapPad3500ULM導(dǎo)熱界面材料系列以更好的貼服性，更高的導(dǎo)熱性能及易于應(yīng)用來滿足電子工業(yè)對導(dǎo)熱界面材料的日益增長的需要；在凹凸不平的表面，空氣間隙和表面粗糙的散熱器與電子元器件之間，廣泛的GapPad3500ULM提供一個(gè)有效的導(dǎo)熱界面。