TDK電容C2012X5R1V226M125AC
尺寸
|
長度(L) |
-
2.00mm ±0.20mm
|
|
寬度(W) |
-
1.25mm ±0.20mm
|
|
厚度(T) |
-
1.25mm ±0.20mm
|
|
端子寬度(B) |
-
0.20mm Min.
|
|
端子間隔(G) |
-
0.50mm Min.
|
|
焊盤布局(PA) |
-
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
|
|
焊盤布局(PB) |
-
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
|
|
焊盤布局(PC) |
-
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
|
電氣特性
|
電容 |
-
22μF ±20%
|
|
額定電壓 |
-
35VDC
|
|
溫度特性 |
-
X5R(±15%)
|
|
耗散因數(shù) (Max.) |
-
10%
|
|
絕緣電阻 (Min.) |
-
22MΩ
|
其他
|
溫度范圍 |
-
-55～85°C
|
|
焊接方法 |
-
流體
-
回流
|
|
AEC-Q200 |
-
NO
|
|
包裝形式 |
-
塑封編帶 (180mm卷筒)
|
|
包裝個數(shù) |
-
2000pcs
|
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